Semi Automatic Wafer Taper
4"-8"wafer application
Blue & UV tape compatible
For 300um+ thickness wafer
wafer edge profile cutting
Advanced ESD roller taping
PLC based control
Automatic tape feeding & taping
Manual wafer loading & unloading
Desktop type
For more information, Please contact us.
building 6, Nanfang Urban Park, Lane 1165, Jindu Road, Minhang District, Shanghai,China.
302, 3rd Floor, Building B, Kaicheng High tech Park, Dalang Street, Longhua District, Shenzhen, China