4"-8"/8"-12"wafer application
Automatic support wafer & device wafer bonding
Thinner wafer capability
Opitonal post measuring bonded wafer
Vacuum thermal press bonding
Compatible wafer cassette / wafer box
PC based control with Windows OS
Intelligent wafer mapping in cassette
SECS/GEM or simple link capability
Automatic support wafer & device wafer aligning
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