4"-8"/ 8"-12"wafer application
Thinner wafer capability
Compatible wafer cassette /wafer box
Used bonding tape robot peeling
Automatic wafer mounting
Built-in UV irradiating module
PC based control with Windows OS
Intelligent wafer mapping in cassette
SECS/GEM or simple link capability
Automatic bonded wafer aligning
Thermal debonding device wafer & support wafer
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