JEL SAL3262HV
Aligner
Peculiarity
Be used to 100 to 150 mm wafer
High-speed, high-accuracy centering and flat/notch locating are available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer
Equipped with JEL-developed image sensor, and internal motor driver and controller.
Size, shape, material of spindle can be changed according to the wafer type.
Bernoulli type is also available.
Control: RS232C and parallel photo I/O
Available for non-SEMI standard notch or flat
Optional Z-axis for pick-up/place operation is available
